FEINMETALL ViProbe® is a buckling beam technology for contacting pads. The contact can be done with and without scrub – depending on the application. It fits for contacting on aluminum-, copper-, gold-, palladium- and other pads.
With the introduction of the next generation of vertical wafer probing, the ViProbe®II, all these advantages are extended by multiple lifetime extension options and further security additions to ensure security of the DUT.
|Min pitch of the DUT||Down to 40 μm|
|Diameter of the contact element||Down to 1.1 mil|
|Max active area||Up to 105 mm x 105 mm|
|Capable temperature range||From -55°C to 180°C|
|Current carrying capability at RT||Up to 800 mA|
|Contact force at rec. OD||From 2.2 cN to 10.8 cN|