Developing new Probe Card solutions is an ongoing process, the FEINMETALL development team is constantly in touch with the worldwide semiconductor test experts, always tracking the latest trends and technologies.
Here are the latest product developments for the semiconductor test markets.
The FEINMETALL LiProbe® is the solution for advanced probing requirements. It has been designed to ensure a specific contact force as well as maintaining it over the whole lifetime. The lamella technology allows the probe to be much shorter than a conventional buckling beam and therefore is used in applications which require advanced frequency requirements.
Due to the flexibility of the probe design it is possible to equip a probe head with probes in different geometries depending on their
specific function.
Advantages
Min pitch of the DUT | Down to 80 μm | ||
Max active area | Up to 105 mm x 105 mm | ||
Capable temperature range | From -55°C to 180°C | ||
Current carrying capability at RT | Up to 900 mA | ||
Contact force at rec. OD | From 2.8 cN to 5.4 cN | ||
Bandwidth analog @ -1dB limit | Up to 30 GHz | ||
For a wide range of applications, fast and easy probing solutions are required. However, performance wise, vertical probing solutions offer many advantages compared to epoxy solutions: With the BasicProbe, FEINMETALL offers all these advantages in an easy, fast, and economic vertical probe card. The advantages of a vertical solution are clear: The stable force on the DUT compared to the linear
when using an epoxy card as well as the maintenance options.
Advantages
Min pitch of the DUT | Down to 80 μm | ||
Diameter of the contact element | Down to 2 mil | ||
Max active area | Flexible | ||
Capable temperature range | From RT to 85°C | ||
Current carrying capability at RT | Up to 800 mA | ||
Contact force at rec. OD | From 3.4 cN to 10 cN | ||