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Wafer Test Workshop

Jerry Broz and Matthias Schnaithmann

New method of measuring the current carrying capability of a probe card

Dr. Matthias Schnaithmannn presented a new method for measuring the current carrying capability of probe cards.

An essential feature of the contact elements of probe cards is the electrical current carrying capability. In the past, a standard (CCC, Current Carrying Capability according to ISMI 2009) was developed for this purpose. This standard is based on the change in contact force as a function of the applied current. This presentation takes a critical look at this procedure and presents an alternative, improved characterization method.

The new measuring method not only allows the analysis of the contact force but also the plastic deformation (MAC, Maximum Allowable Current) of the contact element as a function of the current.

All presentations of the workshop can be found directly on the corresponding page of the event (link below), the award-winning presentations can be found at "Awarded Presentations".

SEMICONDUCTOR WAFER TEST WORKSHOP 2018 - PRESENTATIONS