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FeinProbe®

Probe
Cards

FEINMETALL FeinProbe® is based on spring contact probes as contact elements. This technology is ideal for fine pitches of WLP applications and can be used for WLCSP, WLAN , RF , SiP, analog and mixed signal flip chip applications.

Advantages

  • Stable and consistent contact resistance with low bump damage
  • High bandwidth of contact elements
  • Best for high current applications (up to 2,1 A)
  • Suitable for test of single or multi packages together with manual actuators
  • Low cost of ownership

 

Application examples

FeinProbe® - X01

The FeinProbe® X01-type is designed for solder bump wafer test applications with a minimum solder bump pitch of down to 350 μm. A special probe design allows using this solution for applications with a bandwidth up to 9.3 GHz and temperatures up to 150 °C. The FeinProbe® is capable of probing grid array, single and multi-DUT layout applications.

FeinProbe® - X02

The FeinProbe® X02-type is designed for solder bump wafer test applications with minimum solder bump pitch 500 μm. A special probe design allows matching the ViProbe® probe card depth. The spring contact probe design allows using this solution for test temperatures up to 150 °C. The FeinProbe®is capable of probing grid array, single and multi-DUT layout applications.

Specifications at a glance

Contact elements: contact probes X01, X02
Pitch: down to 350 µm
Beam count: up to 5 000
Active area: up to 60 mm x 60 mm
Temperature range: -40°C to 150°C