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CiProbe®

Probe
Cards

FEINMETALL CiProbe® is based on pre-formed wire contact elements. It is ideal for testing CPU or GPU processors, FPGA, analog and mixed signal, flip chip and grid array solder bump applications.

Advantages

  • Best for contacting on lead free solder bumps
  • Best for high current applications (up to 3 A)
  • Easy and fast maintenance
  • Low cost of ownership
  • Mature and robust technology

 

Application examples

CiProbe® - E Type
The CiProbe® E-type is designed for solder bump wafer test applications with minimum bump pitch 250 μm. An advanced contact element alloy allows to increase the current carrying capability up to 3 A per probe. The CiProbe® is capable of probing grid array, single and multi-DUT layout applications.

CiProbe® - P Type
The CiProbe® P-type is designed for solder bump wafer test applications with minimum bump pitch 180 μm. A unique and advanced contact element alloy allows to increase the current carrying capability up to 1.7 A per probe. The CiProbe® is capable of probing grid array, single and multi-DUT layout applications.

Specifications at a glance

Contact elements: 4 mil - 5 mil
Pitch: down to 180 µm area array
Beam count: up to 8 000
Active area: up to 60 mm x 60 mm
Temperature range: -40°C to 150°C